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Электронный компонент: UPG132G

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GaAs INTEGRATED CIRCUIT
P
P
P
P
PG137GV
L-BAND SPDT SWITCH
1996
Document No. P13057EJ2V0DS00 (2nd edition)
Date Published November 1997 N
Printed in Japan
DATA SHEET
DESCRIPTION
The
P
PG137GV is a L-Band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital
mobile communication system.
It housed in an very small 8-pin SSOP that is smaller than usual 8-pin SOP and easy to install and contributes to
miniaturizing the system.
FEATURES
Maximum transmission power : +35 dBm min. (@ V
CONT
= +5 V/0 V)
+34 dBm typ. (@ V
CONT
= +3 V/0 V)
Low insertion loss
: 0.55 dB typ. (@ 1 GHz)
0.65 dB typ. (@ 2 GHz)
APPLICATION
Digital Cellular : GSM, PDC, PCN etc.
PHS Base Station, PCS etc.
ORDERING INFORMATION
PART NUMBER
PACKAGE
PACKING FORM
P
PG137GV-E1
8 pin plastic SSOP (175 mil)
Carrier tape width 12 mm Qty 2 kp/Reel.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 C)
PARAMETERS
SYMBOL
RATINGS
UNIT
Control Voltage 1, 2
V
CONT1, 2
0.6 to +6.0
Note
V
Input Power (V
CONT
= +5 V)
P
in
+36
dBm
Input Power (V
CONT
= +3 V)
P
in
+34
dBm
Total Power Dissipation
P
tot
0.7
W
Operating Temperature
T
opt
50 to +80
C
Storage Temperature
T
stg
65 to +150
C
Note
( ) stands for the case of positive control condition using the floating.
Condition 2.7
d
| V
CONT1
V
CONT2
|
d
6.0 V
Caution
The IC must be handled with care to prevent static discharge because its circuit composed of
GaAs MES FET.
2
P
P
P
P
PG137GV
PIN CONNECTION DIAGRAM (Top View)
1
2
3
4
8
7
6
5
1. V
CONT2
2. OUT2
3. GND
4. GND
5. IN
6. GND
7. OUT1
8. V
CONT1
G137
SPDT SWITCH IC SERIES PRODUCTS
PART
NUMBER
PIN (1 dB)
(dBm)
L
INS
(dB)
ISL (dB)
V
CONT
(V)
PACKAGE
APPLICATIONS
P
PG130G
+34
0.5 @ 1 G
32 @ 1 G
5/0
PDC, IS-136, PHS
P
PG131G
+30
0.6 @ 2 G
23 @ 2 G
4/0
PHS, PCS, WLAN
P
PG132G
+30
0.6 @ 2 G
22 @ 2 G
+3/0
PHS, PCS, WLAN
P
PG133G
+25
0.6 @ 2 G
20 @ 2 G
3/0
DIVERSITY, VCO
P
PG137GV
+34
0.55 @ 1 G
25 @ 2 G
+3/0
PDC, GSM, IS-136
P
PG138GV
+34
+37
0.55 @ 1 G
30 @ 1 G
3/0
5/0
PDC, GSM, IS-136
Remark
As for detail information of series products, please refer to each data sheet.
8-pin SSOP
(175 mil)
3
P
P
P
P
PG137GV
[
P
P
P
P
PG137GV]
RECOMMENDED OPERATING CONDITIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Control Voltage (ON)
V
CONT
+2.7
+3.0
+5.3
V
Control Voltage (OFF)
V
CONT
0.2
0
+0.2
V
Input Power (V
CONT
= +5 V)
P
in
+35
dBm
Input Power (V
CONT
= +3 V)
P
in
+33
dBm
ELECTRICAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED T
A
= 25
q
q
q
q
C, V
CONT
= +3 V/0 V)
CHARACTERISTICS
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Insertion Loss 1
L
INS1
f = 100 M to 1 GHz
0.55
0.75
dB
Insertion Loss 2
L
INS2
f = 2.0 GHz
0.65
0.90
dB
Insertion Loss 3
L
INS3
f = 2.5 GHz
0.8
Note 1
dB
Isolation 1
I
SL1
f = 100 M to 2 GHz
20
25
dB
Input Return Loss
RL
in
f = 100 M to 2 GHz
11
dB
Output Return Loss
RL
out
11
dB
Input Power at 1 dB
Compression Point
P
in
(1 dB)
Note 2
f = 500 M to 2 GHz
+32
+34
dBm
Input Power at 0.5 dB
Compression Point
P
in
(0.5 dB)
f = 500 M to 2 GHz
V
CONT
= +5 V/0 V
+34
dBm
Switching Speed
t
SW
30
ns
Control Current
I
CONT
V
CONT
= +5 V/0 V
5
P
A
Notes 1. Characteristic for reference at 2.0 to 2.5 GHz.
2. P
in
(1 dB) is measured the input power level when the insertion loss increase more 1 dB than that of
linear range.
All other characteristics are measured in linear range.
NOTE ON CORRECT USE
When the
P
PG137GV is used it is necessary to use DC blocking capacitor for No. 2 pin (OUT2), No. 5 pin (IN)
and No. 7 pin (OUT1). The value of DC blocking capacitors should be chosen to accommodata the frequency of
operation.
Insertion loss and isolation of the IN-OUT2 is better than that of IN-OUT1, because No. 7 pin (OUT1) is placed to
same side of No. 5 pin (IN).
The distance between IC's GND pins and ground pattarn of substrate should be as shorter as possible to avoid
parasitic parameters.
4
P
P
P
P
PG137GV
TYPICAL CHARACTERISTICS (T
A
= 25 C) (This data is including loss of the test fixture)
+2.0
+1.0
0
1.0
2.0
3.0
100 M 200 M
500 M
1 G
2 G 3 G
V
CONT1
= 0 V
V
CONT2
= +3 V
P
in
= 0 dBm
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
IN-OUT1 ISOLATION vs. FREQUENCY
IN-OUT1 INSERTION LOSS vs. FREQUENCY
f - Frequency - Hz
L
INS
- Insertion Loss - dB
L
INS
OUT1
OUT2
IN
50
f - Frequency - Hz
ISL
OUT1
OUT2
IN
50
10
30
40
50
100 M 200 M
500 M
1 G
2 G 3 G
V
CONT1
= +3 V
V
CONT2
= 0 V
P
in
= 0 dBm
ISL - Isolation - dB
20
0
RL
in
OUT1
OUT2
IN
50
RL
OUT
OUT1
OUT2
IN
50
+10
0
20
30
40
100 M 200 M
500 M
1 G
2 G 3 G
V
CONT1
= 0 V
V
CONT2
= +3 V
P
in
= 0 dBm
f - Frequency - Hz
RL
in
- Input Return Loss - dB
f - Frequency - Hz
0
20
30
40
100 M 200 M
500 M
1 G
2 G 3 G
V
CONT1
= 0 V
V
CONT2
= +3 V
P
in
= 0 dBm
RL
out
- Output Return Loss - dB
10
+10
10
5
P
P
P
P
PG137GV
+2.0
+1.0
0
1.0
2.0
3.0
100 M 200 M
500 M
1 G
2 G 3 G
V
CONT1
= +3 V
V
CONT2
= 0 V
P
in
= 0 dBm
IN-OUT2 INSERTION LOSS vs. FREQUENCY
f - Frequency - Hz
L
INS
- Insertion Loss - dB
L
INS
OUT1
OUT2
IN
ISL
OUT1
OUT2
IN
0
10
20
30
40
50
100 M 200 M
500 M
1 G
2 G 3 G
V
CONT1
= 0 V
V
CONT2
= +3 V
P
in
= 0 dBm
IN-OUT2 ISOLATION vs. FREQUENCY
f - Frequency - Hz
ISL - Isolation - dB
RL
in
OUT1
OUT2
IN
50
RL
OUT
OUT1
OUT2
IN
50
+10
0
10
20
30
40
100 M 200 M
500 M
1 G
2 G 3 G
V
CONT1
= +3 V
V
CONT2
= 0 V
P
in
= 0 dBm
IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY
f - Frequency - Hz
RL
in
- Input Return Loss - dB
+10
10
20
30
40
100 M 200 M
500 M
1 G
2 G 3 G
V
CONT1
= +3 V
V
CONT2
= 0 V
P
in
= 0 dBm
IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY
f - Frequency - Hz
RL
out
- Output Return Loss - dB
0
50
50
6
P
P
P
P
PG137GV
TEMPERATURE CHARACTERISTICS
Pin (1dB) vs. AMBIENT TEMPERATURE
100
80
60
40
20
0
20
40
60
80
100
34
33
32
31
30
Pin - Input Power (1dB) - dBm
T
A
(
C)
V
CONT1
= +3 V
V
CONT2
= 0 V
f = 2 GHz
Non modulated
Signal input (CW)
INSERTION LOSS, 2fo, 3fo vs. AMBIENT TEMPERATURE
T
A
(
C)
L
INS
- Insertion Loss - dB
V
CONT1
= +3 V
V
CONT2
= 0 V
f = 2 GHz
Non modulated
signal input (CW)
2fo
3fo
L
INS
1.0
0.8
0.6
0.4
50
60
70
2fo
,
3fo
Harmonics (dBc)
100
50
0
+50
+100
7
P
P
P
P
PG137GV
[
P
P
P
P
PG137GV]
TEST BOARD
R
R
C2
C1
C3
NEC
G132
OUT1
V
CONT1
V
CONT2
OUT2
IN
0.9 mm width.
0.4 mm thickness
teflon glass
R = 50
Using the same board
that of PG132G
TEST CIRCUIT
C1
V
CONT2
= 0 V/+3 V
OUT2
50
50
1 000 pF
Z
O
= 50
Z
O
= 50
Z
O
= 50
C2
C3
V
CONT1
= +3 V/0 V
1 000 pF
OUT1
IN
C1, C2, C3 = 51 PF
1
2
3
4
8
7
6
5
8
P
P
P
P
PG137GV
[
P
P
P
P
PG137GV]
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
V
CONT1
+3 V
0 V
V
CONT2
+3 V
OUT1
OUT2
IN
OUT1
OUT2
IN
0 V
OUT1
OUT2
IN
OUT1
OUT2
IN
PACKGE DIMENSIONS
8-PIN PLASTIC SHRINK SOP (175 mil) (Unit mm)
8
5
1
4
3.0 MAX
0.15
0.87 0.2
4.94 0.2
3.2 0.1
0.15
+0.10 0.05
0.5 0.2
3
+7 3
0.575 MAX
0.1 0.1
1.8 MAX
1.5 0.1
0.10
M
0.3
+0.10
0.05
0.65
Detail of lead end
9
P
P
P
P
PG137GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
[
P
P
P
P
PG137GV]
Soldering process
Soldering conditions
Recommended condition symbol
Infrared ray reflow
Package peak temperature: 235
q
C
Hour: within 30 s. (more than 210
q
C)
Time: 3 times, Limited days: no.
Note
IR35-00-3
VPS
Package peak temperature: 215
q
C
Hour: within 40 s. (more than 200
q
C)
Time: 3 times, Limited days: no.
Note
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260
q
C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Note
WS60-00-1
Pin part heating
Pin area temperature: less than 300
q
C, Hour: within 10 s.
Limited days: no.
Note
Note It is storage days after opening a dry pack, the storage conditions are 25
q
C, less than 65 %, RH.
Caution
The combined use of soldering method is to be avoided (However, except the pin area heating
method).
10
P
P
P
P
PG137GV
[MEMO]
11
P
P
P
P
PG137GV
[MEMO]
P
P
P
P
PG137GV
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5